EBS Engineering
and Construction

320 Woolwich Street South
Breslau, ON
N0B 1M0
Phone: 519-648-3613
Toll free: 866-649-3613

Twitter

Speakers at the Helical Pier and Micropile Seminar
Posted at 06:29 pm Monday December 19th 2011

The "Engineering Design and Construction Seminar" will be held February 8th and 9th in Brampton, Ontario.

Click here to view brochure

Speakers:

Dr. Hesham El Naggar PhD, P.Eng. – Dr. El Naggar is the Associate Dean Research and Graduate Studies at The University of Western Ontario in London Ontario.  His research has been focused on deep foundation systems including how helical piers and micropiles perform in seismic events.

Mr. Gary Seider P.E. – Mr Seider is the Engineering Manager at Chance. Gary has been working with the Chance Helical product for 20 years and has developed and patented many products currently used in helical applications

Mr. Samuel P. Clemence P.E. – Mr. Clemence is a Meredith Professor in Civil and Environmental Engineering at the Syracuse University in New York.  Sam has completed significant research on helical piles and their performance in may types of soils and applications. 

Mr. Trevor Quayle M.A.Sc, P.Eng. – Mr Quayle is a structural design engineer working for Pretium Anderson in Kitchener Ontario.  Trevor has spent the better part of the last five years designing helical piers and micropiles in many different types of applications in unique and difficult situations.

Mr. Don Dotson PhD, PE, SE, P.Eng, D.Ge - Mr. Dotson is a Senior Engineer and Chief Designer for AMEC with over 30 years of multi-disciplinary engineering experience. Don is an Adjunct Professor of Civil Engineering at Tennessee State University teaching the Geotechnical Engineering sequence. He is also a Peer-Reviewer for the ASCE Journal of Geotechnical and Geoenvironmental Engineering and a 2010 inductee as a Diplomate, Geotechnical Engineering by the Academy of Geo-Professionals.

Share on Facebook Share via Email Share via Twitter


Deep Foundation Applications for Helical Piers and Micropiles.